1～9 item / All 9 items
Measurement of Si wafer thickness, front and back surface P/N determination.
Thickness measurement of 4”, 5”, 6”, and 8” Si wafers, determination of front and back P/N, and resistivity measurement will be conducted, and based on the results, sorting will be performed into cassettes that have been pre-set in the recipe.
This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern.
By holding three points on the outer circumference of the silicon wafer and rotating the θ table, the thickness at any location can be measured. Our unique "non-contact earth" method allows for safe, non-contact handling.
Large-diameter silicon wafer measuring instrument
- The thickness of the silicon wafer will be measured non-contact. - A laser length measuring device will be used to measure the thickness. - The thickness measurement data will be saved on a PC.
This is a device that removes silicon wafers from a dedicated cassette and measures the thickness at the set points.
- The wafer thickness is measured non-contact using a capacitance sensor. - Wafer size changes are possible through recipe settings, eliminating the need for setup changes. - The measurement point is set to one point at the center, with cross measurements configured in the recipe. The number of points and their positions during cross measurements can also be specified. - The measured data is saved on the accompanying computer.
This machine is a device for measuring the thickness of φ8” silicon wafers.
It is a device that performs non-contact, automatic measurements of the thickness of Si wafers and various measurements of Si step parts.
This is a thickness measuring device compliant with JIS standards. You can choose specifications based on the respective testing standards for films, paper, rubber, textiles, and knitted fabrics.
●Specifications based on JIS Z 1702 (film), P 8118 (paper), JIS K 6250* (rubber), L 1096 (textiles and knits), etc. can be manufactured (indentation diameter and applied pressure). (*Hardness IRHD or higher) ●Measurement results are output to a compact printer. ●Data can be transferred to a PC*. (*PC and software are optional)
The very popular TME series
□TME-02A Type/TME-02B Type□ This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern. It holds three points on the outer circumference of the silicon wafer and rotates the θ table to measure the thickness at any desired location. Thanks to our unique "non-contact earth" method, it allows for safe and non-contact handling. It is equipped with a barcode reader, and the scanned barcode number can be saved in a specified cell in Excel. □TME-03 Type□ This is a device that extracts silicon wafers from a dedicated cassette and measures the thickness of a set pattern. The chucking of the silicon wafer during transport and measurement at the stage uses vacuum to hold the backside.
This machine is a device for measuring the thickness of φ4, 5, 6, and 8-inch wafers.
Thickness measurement is performed using multi-point measurements according to the recipe. The measurement sensor uses a spectroscopic interference method sensor to perform measurements from one side.
The thickness of the laser disc will be measured (both contact and non-contact) and used within the evaluation system.
We will build a system for measuring various parameters such as voltage, current values, temperature and humidity, and pressure, as well as data processing. Additionally, Cosmotec's inspection equipment, based on measurement technology, plays a central role in quality assurance at our customers' production sites. 【Configuration】 ○CPU: Z80 4MHz ○ROM: 4Kbyte ○RAM: 1Kbyte ○I/O: TTL, 6 Port ●For more details, please download the catalog or contact us.
